FSRM presents a new course: Reliability and Test

This course has been developed to give attendees the background to perform Microsystem reliability characterization from the component to system levels. Initially, the fundamentals of mechanical, environmental, and reliability testing as applied to Microsystems will be presented. The focus begins with the characterization of single components and structures; these are illustrated with practical examples from industry. These procedures are applied to MEMS and Microsystem level reliability test applications. Test techniques, specifications, and methodology are presented in detail with examples from industry.

Target group
This course is designed for the practicing scientist or engineer to provide a foundation in surface mechanical properties characterization and reliability testing of Microsystems and Micro-Electro Mechanical Systems (MEMS).


  • Fundamentals of surface mechanical properties testing methods and application to both bulk and coated materials
  • Basics of material mechanics, environmental and reliability testing
  • Adhesion, residual stress, nanoindentation, nanoscratch, nano and micro-tribology
  • Static and dynamic test methodology as applied to micron and nano-scale components and systems
  • Reliability testing of layered materials, precision components, micron and sub-micron scale structures, contacts, and systems
  • Methodology for defining and creating test specifications at the Micro-component and system levels
  • Applications will be presented that include optical shutters, micro-switches, electrical contacts, accelerometers, fluid channels (Bio-MEMS), sliding interfaces, adhesive contacts, etc.

Dr Nicholas X. Randall, CSM Instruments, Boston, USA.

Nicholas Randall: 1994 Bachelor of Science in Materials Technology from Brunel University (London, GB). 1997 PhD Thesis ‘Development & Application of a Multifunctional Nanotribological Tool’ from University of Neuchâtel (Neuchatel, CH). This project concluded in the commercial development of a testing instrument for characterising thin film mechanical properties and MEMS. 1996 – 2002 Customer Services Manager at CSM Instruments, Neuchâtel, responsible for Applications Laboratory, After-sales service, scientific literature and final testing of production instruments. 2002 Vice-President Business Development: Responsible for setting-up CSM Instruments subsidiary office in Boston USA. Active in continuing development of MEMS testing issues and applications.

FSRMInformation and registration

Date and place  21.09.2009 – 22.09.2009 in Zurich (CH)
Duration 2 days
Fees  CHF 1’100.00 / EUR 750.00
You can register here.

Want to know more about FSRM? You can go here or download the information brochure here. (1Mb)