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FSRM presents a new course: Reliability and Test

August 2009

This course has been developed to give attendees the background to perform Microsystem reliability characterization from the component to system levels. Initially, the fundamentals of mechanical, environmental, and reliability testing as applied to Microsystems will be presented. The focus begins with the characterization of single components and structures; these are illustrated with practical examples from industry. These procedures are applied to MEMS and Microsystem level reliability test applications. Test techniques, specifications, and methodology are presented in detail with examples from industry.

Target group This course is designed for the practicing scientist or engineer to provide a foundation in surface mechanical properties characterization and reliability testing of Microsystems and Micro-Electro Mechanical Systems (MEMS).

Content

Tutors Dr Nicholas X. Randall, CSM Instruments, Boston, USA.

Nicholas Randall: 1994 Bachelor of Science in Materials Technology from Brunel University (London, GB). 1997 PhD Thesis ’Development & Application of a Multifunctional Nanotribological Tool’ from University of Neuchâtel (Neuchatel, CH). This project concluded in the commercial development of a testing instrument for characterising thin film mechanical properties and MEMS. 1996 - 2002 Customer Services Manager at CSM Instruments, Neuchâtel, responsible for Applications Laboratory, After-sales service, scientific literature and final testing of production instruments. 2002 Vice-President Business Development: Responsible for setting-up CSM Instruments subsidiary office in Boston USA. Active in continuing development of MEMS testing issues and applications.

Information and registration Date and place 21.09.2009 - 22.09.2009 in Zurich (CH) Duration 2 days Fees CHF 1’100.00 / EUR 750.00 You can registerhere.

Want to know more about FSRM? You can go here or download the information brochure here. (1Mb)

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