CAD

Enhanced Options in Simulation

August 2021

During Fakuma 2021, SIGMA Engineering presents the latest release of SIGMASOFT Virtual Molding. It furthermore contains refined prediction of warpage besides numerous enhancements for calculation of multicomponent parts and introduces the new option to analyze compression molding processes. 

The new SIGMASOFT release allows users an even more accurate prediction and analysis of warpage.

 

At Fakuma (12.-16. October 2021) in Friedrichshafen, Germany, SIGMA Engineering GmbH presents advancement of SIGMASOFT on Booth A5-5110. The new and bigger exhibition space allows visitors to collect all details of the new Version 5.3.1 besides new application examples and simulation approaches.

„We look forward to finally meeting our network of partners and customers in person again. The bigger space is a great support to showcase the benefits of our SIGMASOFT Virtual Molding Technology and Autonomous Optimization. And we are happy to present the updates of the newest version in detail“, says SIGMA CTO Timo Gebauer. The update not only contains the new possibility to simulate compression molding processes of elastomers; it also offers many enhancements and improvements in the area of thermoplastics.

The prediction of warpage was again improved. „Since shrinkage and distortion are essential for the correct design of plastic parts, we continuously strive to compute them even more precisely“, Gebauer explains, „for example we are working with DUFNER.MDT GmbH since three years, to further improve our material datasets especially for warpage prediction.“ Besides the improved material data SIGMASOFT v5.3.1 also contains new criteria, to make the evaluation more precise and user-friendly.

Another important update is introduced for the calculation of multicomponent projects. It is now possible, to run virtual Design of Experiments (DoE) and optimizations for all components at the same time, in order to adjust them precisely to each other. How to develop multicomponent parts including molds and process with the help of Virtual Molding and virtual DoE is also demonstrated at the SIGMA booth. The showcased example is the cell-phone-holder „Butterfly“ by Elmet, shown in full production on K show 2019.

Other recent practical examples created with support of SIGMASOFT are shown on the fairground:

www.sigmasoft.de

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