September 13 to 16, 2010 do not miss the assembly, handling technology and automation, plus industrial bonding technology event of the year
MOTEK = assembly technology and more, BONDexpo = bonding technology and more: with this trade fair duo, private trade fair company P. E. Schall GmbH & Co. KG seamlessly pursues its successful series of fairs for the complementary process chain issues of production and assembly automation, joining and bonding technology, being set to provide another boost for business in autumn 2010. With more than 1,000 exhibitors – more than 900 at this 29th edition of MOTEK and nearly 100 at the 4th BONDexpo – these twin trade fairs will once again be turning Stuttgart trade fair centre, at the mighty economic centre of Europe, into a mecca for the international production and assembly automation sector and the bonding technology which goes hand in hand with it, and building a comprehensive picture of the industry worldwide.
From drive solutions to integrated robotics The organisers are delighted to see that virtually all the “old” exhibitors will be back at MOTEK alongside numerous new exhibitors, first and foremost system integrators and plant engineering companies, proving that MOTEK is a valued meeting point for all those involved in production, assembly and material flow automation. While German-speaking countries, especially Germany, make up the lion’s share of the exhibitors and new technologies, the exhibitors come from a total of 24 countries all over the world, rightly earning MOTEK the title of the world’s number one trade fair.
MOTEK and BONDexpo – an unrivalled range of components and systems In this context, it is interesting to note that MOTEK and BONDexpo combined have attracted a perceptibly larger stream of manufacturers and vendors of robotics. This can be viewed not least as evidence of the increased use of robots as a universal but also standardised element of production and assembly automation. Also present at MOTEK is the usual complete spectrum of manufacturers and vendors of components for plant, systems and peripherals for material flows, separation, feed technology and bonding, affording an across-the-board view of the sector for trade visitors. To allow visitors to find their way around this gigantic fair without wasting time, the total exhibition surface area of 60,000 square metres – which is completely booked out as things currently stand – is packed into halls 1, 3, 5, 7 and 9, allowing the individual halls or offerings to be organised efficiently and meaningfully by product and solution. BONDexpo and special shows an integral part of the fair Last but not least, the 2010 MOTEK and BONDexpo trade fair duo will again be showing a complete spectrum of information and communications, with special shows such as the Education & Research and Application Parc theme parks, a collective stand hosted by the IPA Fraunhofer Institute for Manufacturing Engineering and Automation on rapid part manufacturing, a training congress, expert sessions and the brand-new “Arena of Innovations”. MOTEK and BONDexpo show the state of the art in hardware and software both in theory and in practice, supplying designers and machine and plant engineers – but first and foremost users – with the tools they need to find parts and system solutions for all production, assembly, material flow and bonding tasks. www.motek-messe.de/de/motek www.bondexpo-messe.de/de/bondexpo
P.E. SCHALL GmbH & Co. KG Gustav-Werner-Straße 6 72636 Frickenhausen www.schall-messen.de Tel: +49 (0)7025 / 92 06-673 Fax: +49 (0)7025 / 92 06-625 [email protected]
PS: Do not miss the interview of Ms and Mr Schall about Microsys here. (Microsys takes place from September 13 to 16 in Stuttgart too).
