The tried-and-tested Evo2Step joining process is becoming increasingly popular, especially in the field of electromobility. The 2-step welding process for components made of the same material not only saves resources, but is also energy-efficient and environmentally friendly. Thanks to technical progress and the availability of new materials, direct laser welding is gaining new possibilities. New areas of application are being developed and processed. In 1-step laser welding processes (…)
Topics / Laser micro-machining
Laser micro-machining
Emerson´s New Laser Welder Automates Assembly of Small Plastic Parts with Complex Geometries
Branson GLX-1 platform offers automation-friendly solution for clean, vibration-free welding that supports closed-loop product recycling. Emerson has announced its new Branson™ GLX-1 Laser Welder, which offers users flexibility to meet the growing demand for joining small, complex or delicate plastic components and assemblies. Its small footprint and modular design make it compatible for use in ISO-8 cleanroom environments, while an integral automation controller simplifies installation (…)
Laser micro-machining
New 3D short pulse fiber laser marker LP-ZV by Panasonic Industry
Panasonic Industry’s long-lasting, energy-efficient fibre laser markers have further evolved a laser marking system with 1ns short pulses and 3D control. Panasonic Industry introduced the latest innovation in laser marking technology: The LP-ZV series offers high speed and precision in laser marking, making it ideal for a wide range of metal or plastic marking applications. Whether you need to mark text, graphics, barcodes, or 2D codes, the LP-ZV series can handle it all with ease: (…)
Laser micro-machining
Powerful Laser Technology for the Electronics Industry
productronica, which will be held on November 14–17 in Munich, is the world’s leading trade fair for electronics development and production. LPKF will be there to present systems for PCB prototyping, PCB depaneling, stencil production, and laser plastic welding with a new, modern exhibition booth at Booth B2.303 in Hall B2. This year’s Semicon Europa is located in the same hall. At Booth B2.154, LPKF will present innovative glass machining using the Vitrion laser machines, for example, (…)
Laser micro-machining
Successful participation in innovation contest - EVOSYS receives Top 100 seal again
Evosys Laser GmbH from Erlangen has convinced with its innovation qualities and received the TOP 100 seal 2023. Only particularly innovative medium-sized companies receive this award. Among other things, the jury was convinced by the systematic planning of innovations at EVOSYS. EVOSYS also impressed in the 30th round of the TOP 100 innovation competition, making the company one of Germany’s top innovators since February 1. The competition is based on a scientific selection process. (…)
Laser micro-machining
EVOSYS wins another innovation prize with the Best of Industry Award
Evosys Laser GmbH wins Best of Industry Award in the plastics technology category. The innovative and patented AQW process convinced the jury and the readers here as well. The Erlangen-based company develops and manufactures laser welding systems for processing plastics. These are used, for example, in the automotive, medical technology or consumer product industries. Laser welding of plastics is an established and widely used manufacturing process. It is valued above all for its (…)
Laser micro-machining
LIDE Technology Used in Series Produc-tion of Glass Wafers
The technology company LPKF has received a follow-up order from the semiconductor industry. A leading global chip manufacturer had installed a first LIDE system at the beginning of 2020 and, after a qualification phase, initially used it for its own product development. Further LIDE systems have now been ordered so that volume production of electronic components with chip housings made of glass can get underway. The parties agreed not to disclose any details. With the LIDE (Laser Induced (…)
Laser micro-machining
More Laser Power for Higher Performance: The new LPKF CuttingMaster 2122 improves depaneling efficiency
LPKF has enhanced the performance of the proven and popular LPKF CuttingMaster depaneling system even more with a newly developed laser source. Initial applications demonstrate a significantly higher cutting speed and, as a result, an up to 25% higher output. For users, this yields a whole new dimension for improving efficiency in this price-to-performance range. It gives PCB manufacturers the full advantages of laser technology for the price of a milling machine. The new system variant (…)
Laser micro-machining
PCB Depaneling: Laser Technology Improves Quality and Efficiency for Automotive Applications
The laser offers tremendous potential as a noncontact tool for manifold applications in the automotive industry. For PCB depaneling for the industry, use of laser technology promises high quality, flexibility, and cost efficiency. Nearly everywhere you look in a vehicle, you’ll find printed circuit boards: in the onboard electronics and sensors, in the lighting system, in previously purely mechanical systems such as seat or mirror adjusters, and in many other in-vehicle applications. (…)
Laser micro-machining
Laser systems save time-consuming post-processing when cutting foam
Seals, filters, fluid reservoirs, carriers for special adhesive tapes: Thanks to special material properties, INDUCON brand foams are used in a wide variety of products and industries around the world. Extensive tests in the eurolaser application laboratory have shown that laser systems are far superior to all other cutting technologies in every aspect when it comes to the packaging of materials. As precise as foam can be processed with traditional technologies, cutting alone rarely gets (…)